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Stress analysis

 

Prediction of thermal stresses and deformation is a necessary task in order to select the correct substrate material and optimize the substrate shape and packaging. axisuite exports 3D temperature fields in Nastran format, which can be directly input to commercial stress analysis software.

 

 Prediction of thermal stresses and deformation during a catastrophic DPF regeneration, using a commercial stress-analysis software, with input from axitrap.

 

 
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